Technical.Info

Presented Paper

2012

Title Presented at Download
Pushing the Limits of Lead-Free Soldering Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
The Stability of Cu6Sn5 in the Formation and Performance of Lead-free Solder Joints Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs
Tin-Copper-Nickel-Germanium, A Case Study in Lead-Free Implementation Pan Pacific Microelectronics Symposium
As originally published in the Pan Pacific Microelectronics Symposium 2012 Conference Programs

2011

Title Presented at Download
The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders SMTAI 2011 Technical Sessions
As originally published in the SMTA International 2011 Conference Proceedings.
The Investigation of an Improved Tin-Zinc Solder for Practical Use International Conference on Electronics Packaging (ICEP) 2011
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter

2009

Title Presented at Download
Inhibition of Cracking in Cu6Sn5 intermetallic Compound at Sn-Cu Lead-Free Solders and Cu Substrate Interfaces International Conference on Electronics Packaging (ICEP) 2009
Japan Institute of Electronics Packaging (JIEP)
IEEE, CPMT Society Japan Chapter

2005-2008

Title Presented at Download
Reliability Testing of Ni-Modified Sn Cu and SAC305 ? Vibration SMTA International 2008
Relationships Between the Impact Strength and Microstructure of Lead-Free Solders International Conference on Soldering and Reliability
Lead-Free Solder Formulation: You need tin, but do you need silver ? ITRI Ltd’s and Metal Events Ltd’s International Tin Conference
Properties That are Important in Lead-Free Solders APEX 2008
Accelerated Reliability Testing of Ni-Modified SnCu and SAC305 IPC/JEDEC International Conference on Reliability, Rework, and Repair of Lead -Free Electronics
Strength of Lead-Free BGA Spheres in High Speed Shear Loading Pan Pacific Microelectronics Symposium
As originally published in the 2008 Pan Pacific Microelectronics Symposium Conference Proceedings.
Impact Strength of Lead-free BGA Spheres IPC/JEDEC Global Conference on Lead Free Reliability and Reliability Testing for RoHS Lead Free Electronics (2007)
The Maximum Fluidity Length of Solidifying Sn-Cu-Ag-Ni Solder Alloys Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0248-8) (2007)
The Influence of 0-0.1wt.% Ni on the Microstructure and Fluidity Length of Sn-0.7Cu-xNi Journal of ELECTRONIC MATERIALS
(DOI: 10.1007/s1 1664-007-0281-7) (2007)
High Reliability Lead-free Solder SN100C (Sn-0.7Cu-0.05Ni+Ge) IPC WORKS ASIA 2007
Measuring the True Wetting Time of Solders APEX 2007
Reliability of Tin/Copper/Nickel Lead-Free Wave Solderings IPC/JEDEC International Conference on Lead Free Electronics Components and Assemblies- “RoHS Compliance and Beyond” (2006)
The Advantages of The Ni-modified Sn-Cu Eutectic Solder as a Lead-free Hot Air Leveled Printed Circuit Board Finish TPCA Exhibition & Conference (2006)
Solidification Behaviour of Lead-Free Alloys and its Relationships to Their Performance as Practical Solders SMTA International Conference (2006)
A rheological assessment of the effect of trace level Ni additions on the solidification of Sn-0.7Cu Scripta MATERIALIA 2006
Advances in the Understanding of the Behaviour of the Ni-Modified Sn-Cu Eutectic as a Lead-free Solder International Conference on Lead Free Soldering (2006)
Solidification Behaviour of the Ni-modified Sn-0.7Cu Eutectic IPC/Soldertec 4th International Conference on Lead Free Electronics (2006)
The Fluidity of the Ni-Modified Sn-Cu Eutectic Lead-free Solder APEX 2006
Microstructure Control in Sn-0.7mass % Cu Alloys Materials Transactions Vol.46, No.11 (2005)
An Alternative Lead Free Electronics Assembly Technology IPC/JEDEC 9th International Conference on Lead Free (2005)
Developments in the Understanding of the Ni-modified Sn-Cu Eutectic as the Basis for a Reliable Lead-free Solder Brasage 2005
A Database for the Transition to Lead-free IPC/JEDEC 3rd International Conference on Lead Free Electronics “Towards the RoHS Directive“ (2005)
A Eutectic Alloy for Lead-free Soldering International Conference on Lead Free Soldering (2005)
The Effect of Ni on the Microstructure and Behaviour of the Sn-Cu Eutectic Lead-free Solder APEX 2005