2014/11/27

NIHON SUPERIOR to Exhibit at INTERNEPCON JAPAN 2015

Nihon Superior Co. Ltd will exhibit in Booth East 2-18 at INTERNEPCON Japan, scheduled to take place Jan. 14-16, 2015 at the Tokyo Big Sight in Tokyo. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.

The reliability of SN100C has been proven in a wide range of electronics assembly products. The SN100C alloy delivers a silver-free stable microstructure that can accommodate the long-term and impact strains to which a solder joint can be subjected. The eutectic character of the SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

For more information about Nihon Superior’s expansive range of SN100C products, meet company representatives in Booth East 2-18.